ABOUT THE STRAIN GAUGE
In the ICT test, a PCB is used by various mechanical mechanisms such as a DESTACO or a vacuum mechanism whose function is to attach the circuit (PCB) to the pins (SPRING PROBES) that test it and create a connection between the PCB and the ICT test - the number of pins, their density, their dispersion on the circuit being examined (which is derived from the circuitry and the location of the test POINTS) and of course the compression force of the pin directly affects the amount of pressure that develops in different areas of the circuit.
During the test of the fixture, possible damage to the printed circuit or its components as a result of the pressure mechanism (vacuum) in the test process.
Disconnect ball of BGA – X RAY vision system
The quality is uncompromising along with the rapid increase in complexity, minimization, density and sensitivity of the components on printed circuits. Especially in aerospace and aerospace and aerospace industries, which are increasingly using built-in components, especially BGA components, requires the development of methods and the provision of creative solutions to ensure that the mechanical and electronic connection during electrical testing (and the test facilities themselves) receives a weighty consideration from the planning stage of the test and final tests. All this in order to meet the stringent requirements, short production times and uncompromising performance.
Magnifitec has developed custom Test according to the IPC-9704 standard in order to measure the strain that evolves on the PCB during testing.
Our fixtures, when tested with strain gauge system are Strain Balanced and free of high strain values spots on the PCB.
This insures the PCB is not damaged while testing due to unbalanced support on it.