INTEGRATED CHIP TESTING
ABOUT ICT TESTERS
ICT fixtures commonly uses Vacuum Method In order to connect huge amount of contact probes to a PCB. While vacuum is applied probes from Top \ Bottom and a lot of cases - from both sides – Also Known as wireless fixtures, touch the PCB in specific test points of Through Holes.
Contacting the specific electrical junctions allow to connect the customer machine to the tested board and allow testing of passive, passive and IC’s (integrated chips). During test flashing can be made for memory type ICs. Accurate mechanism promises contact repeat ability over and over again which promise good testing solution and reliable one.
There are a lot of testing machines out there in the market. Magnifitec has the knowledge and experience to produce ICT tester for all common machines on the market.
Fixtures are made for:
Teradyne machines – Zentel (18XX platform) and Spectrum machines – 885X – Any size
Teradyne new machine LS\LH test station
HP3070 – single and dual Banks
Dual Stage fixtures – B-Level fixture – in order to add functional testing In ICT fixtures
Customization and flexibility
Fully customized customer-oriented design and manufacturing. Open minded for any customer desire for testing ideas.
Fixture is designed in 3D so customer can see pictures of the fixture Before applied to production.
Testers can be customized by according to customer test desire.
Fixture can support wireless B.O.N (Bed of nails) for top access and Bottom Access by nails.
Fixture content – can be customized according to customer desire.
Box hatches for inputs and outputs are according to customer specification.
For any further information on the ICT Fixtures Contact us and a field specialist will get in touch with you shortly.
View our ICT models