LDS Equipment (Laser Direct Structuring)

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Fusion3D 1500
Laser structuring of large components by using the LDS technology.

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Fusion3D 1200
Flexible and efficient Production of 3D Molded Interconnect Devices (MIDs).

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Fusion3D 1100
Entry-level laser structurer for the 3D circuit carrier market.

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LPKF-LDS Process
About the LPKF-LDS process for structuring of MIDs (Molded Interconnect Devices).

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Authorized LDS Manufacturer
Certified producers of 3D-MIDs using the LPKF-LDS process.

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LDS Prototyping
Development of three-dimensional Molded Interconnect Devices.

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LDS Showroom
Discover the set-up of a LDS laboratory and production facility in interactive the showroom.