LDS Equipment (Laser Direct Structuring)

Production of Injection-Molded Interconnect Devices (MIDs)

LDS Equipment (Laser Direct Structuring)

Fusion3D 1500
Laser structuring of large components by using the LDS technology.

Fusion3D 1200
Flexible and efficient Production of 3D Molded Interconnect Devices (MIDs).

Fusion3D 1100
Entry-level laser structurer for the 3D circuit carrier market.

LPKF-LDS Process
About the LPKF-LDS process for structuring of MIDs (Molded Interconnect Devices).

Authorized LDS Manufacturer
Certified producers of 3D-MIDs using the LPKF-LDS process.

LDS Prototyping
Development of three-dimensional Molded Interconnect Devices.

LDS Showroom
Discover the set-up of a LDS laboratory and production facility in interactive the showroom.

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