LPKF MicroLine 2000 P
Precision Cutting for Printed Circuit Boards and Cover Layers
LPKF MicroLine 2000 P
The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.
Process advantages due to LPKF MicroLine 2000 systems
Compared to conventional tools, laser processing offers a compelling series of advantages.
The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.
MicroLine 2000 P - Processing Flat Substrates
UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.
No substrate brackets or cutting tools
More panels on the base material
Perforations and decaps
Integration in MES Solutions
The MicroLine 2000 P seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.
LPKF MicroLine 2000 P - Laser class1
Max. working area (X x Y x Z)
350 mm x 350 mm x 11 mm
(13.8” x 13.8” x 0.4”)
Max. recognition area (X x Y)
300 mm x 300 mm
(11.8” x 11.8”)
Max. material size (X x Y)
50 mm x 350 mm
(13.7” x 13.7”)
Data input formats
Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Max. structuring speed
Depends on application
± 25 μm (1 Mil)
Diameter of focused laser beam
20 μm (0.8 Mil)
System dimensions (W x H x D)
875 mm x 1 530 mm x 1 300 mm
(34.5” x 60.2” x 51.2”)*
~ 450 kg (990 lbs)
230 VAC, 50-60 Hz, 3 kVA
Air-cooled (internal water-air cooling)
22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
< 60 % (non-condensing)