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LPKF MicroLine 2000 Ci

Automated UV Laser for Depaneling of Rigid and Flexible PCBs


LPKF MicroLine 2000 Ci

Compact, high-output and inline-capable. The technology driving the MicroLine 2000 Ci is based on the proven MicroLine 1000 series. It follows the same new modern machine layout as the first system and also has a few things to offer under the hood.

Process advantages due to laser technology

Compared to conventional tools, laser processing offers a compelling series of advantages.

  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths. There is no need to factor in retooling times during a change of production.

  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur. The ablation products are extracted by suction directly at the cutting channel. Even sensitive substrates can thus be precisely processed.

  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.

  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.


Integration in production lines

An integrated SMEMA interface and a newly developed handling system allow the MicroLine 2000 systems to be integrated in the customers’ own production lines. They help the production managers there: The laser system can cut any contours without mechanical conversions and allows production runs with high variance.

Higher throughput

LPKF laser systems can often create components conforming to standards out of deformed base materials. In the MicroLine 2000 Ci, a highly developed vision system is used that can make corrections in the position and rotation angle of the component. The laser beam follows the contours of the real component position. 

The integrated vision system and the internal infeed were further optimized for the MicroLine 2000 Ci so as to minimize non-productive time. In this way, the system can be equipped with a high-output laser source - the processing times thus drop once more and the maximum thickness of the material to be processed rises.

Integration in MES Solutions

The MicroLine 2000 Ci seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.

Technical Data

LPKF MicroLine 2000 Ci - Laser class1

Max. working area (X x Y x Z)

300 mm x 250 mm x 11 mm
(11.8” x 9.8” x 0.4”)

Max. recognition area (X x Y)

300 mm x 250 mm
(11.8” x 9.8”)

Max. material size (X x Y)

300 mm x 250 mm
(11.8” x 9.8”)

Data input formats

Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++

Max. structuring speed

Depends on application


± 25 μm (1 mil)

Diameter of focussed laser beam

20 μm (0.8 mil)

Laser wavelength

355 nm

System dimensions (W x H x D)

875 mm x 1 530 mm x 1 300 mm*
(34.5” x 60.2” x 51.2”)


~ 450 kg (~ 990 pounds)

Operating conditions

Power supply

230 VAC, 50-60 Hz, 3 kVA


Air-cooled (internal water-air cooling)

Compressed air

0.6 MPa (87 PSI)

Ambient temperature

22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)


< 60 % (non-condensing)

Required accessoires

Exhaust unit, external conveyor, production fixture

* Height incl. StatusLight = 2020 mm (79.6”)

MicroLine 2000 Ci series systems feature multiple variations: 
MicroLine 2120 Ci (10 watt laser source), MicroLine 2820 Ci (15 watt laser source), MicroLine 2920 Ci (18 watt laser source) and MicroLine 2000 Ci (27 watt laser source).



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